Interscale Flexible Heat Conductor (FHC), 70 mm
- Designed for ATX/ITX/Mini ITX & COM using Intel core-iprocessors and AMD processors with the following sockets: Intel: LGA775, LGA1150, LGA1155, LGA1156, LGA1366,LGA2011 ; AMD: AM2, AM2(+), AM3, AM3(+), FM1, FM2, FM2(+)
- Compatible with Interscale C enclosures
- Provides industry leading conduction cooling performance, 70% improvement over current conduction cooling methods
- Conductor block expands/contracts vertically to compensate fortolerance stack up and optimizes surface contact and pressurealong the thermal path; eliminates the need for a thermal gappad
- Secured to PCB with mounting brackets, sold separately
Data subject to change without notice
PRODUCT ATTRIBUTES
- Product Type: Conductor Block
- Product Family: Interscale
- Type: Heat Conductor
- Works With: Cases
- Package Quantity: 1
- Depth: 50 mm
- Width: 50 mm
Resellers in your area
Below is a list of local resellers who currently have this item in stock:
Distributor | Quantity | Date in Stock | ||
---|---|---|---|---|
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ADDITIONAL PRODUCT DETAILS
Conductor block expands/contracts vertically to compensate for tolerance stack up and optimizes surface contact and pressure along the thermal path; eliminates the need for a thermal gap pad.
Please order the mounting bracket (Intel or AMD, listed under accessories) to assemble the FHC to the board.
CERTIFICATIONS
Item(s) Delivered
Delivery of this product includes the following item(s):
Item | Description | Quantity | |
---|---|---|---|
1 | Flexible heat conductor, assembled; thermal greaseincluded | 1 | |
2 | Frame, Al | 1 |
RESOURCES
Approval Agency Certificate
Catalog
Data Sheet
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