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Presenting New COM Nano System

nVent SCHROFF has now developed the new much smaller COM Nano System based on the concept of its COM Carrier system, consisting of a modular COM Carrier and a COM Express Type 6 module. With an edge length of 140 mm × 115 mm × 45 mm, this is a powerful miniature computer featuring all the common PC interfaces.  
 
To fit different IP levels, the mechanical case is designed to adapt to several application requirements. The COM Nano System consists of a milled inner case, which also acts as the thermal interface for the processor and other thermal hot spots. An integrated EMC/IP gasket ensures ingress protection class IP53 providing protection against dust and foreign particles, contact and falling water spray at up to 60 degrees from the vertical. A separate U-profile covers the inner case, providing thermal ingress protection. The available PC interfaces – 2× Gigabit Ethernet, 3× USB and a DisplayPort– are recessed into the underside of the case. On the front of the case, there is a small control panel with a push button and a display to indicate the operating status and hard disk activity. 

 
To enable fast processor performance adaptation, the COM Nano System is equipped with Congatec TC370 series modules, which have eighth-generation Intel processors (series i3, i5, i7). These modules work as mobile processors with four cores from Core i5 upwards and result in superior performance, especially for multi-core applications. Other features include up to 64 GB RAM memory, an m.2 NVMe SSD connected via PCIe and an external 12V power supply unit. 

To meet the cooling requirements for a variety of applications, the COM Nano System is available in three configurations. In the first configuration, an integrated heat sink dissipates the heat passively. In the second configuration, a radial fan located within the case, supports the thermal transfer through the heat sink by circulating the air. The third configuration provides the best thermal performance because a radial fan cools the electronic components that do not have a conduction-cooled thermal pathway. It also features a heat sink. For configurations with fans, the design ensures IP protection because the downward-pointing, negative-V-shape of the cooling fins prevent water from entering the fan and the case interior. 

With this new COM Nano System, nVent SCHROFF has demonstrated a way to design a small and powerful COM carrier system. This standard system is also used as the basis for customized configurations.