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CassettePRO with extra cooling capacities

Test and measurement application that needs additional heat dissipation of a hot spot of one bord via FHC to the side panel.


  • Cool the hot spot of the PCB inside the cassette.
  • Use the side panels with cooling fins. Use the FHC to guide the heat from the hot spot of the PCB through the FHC and the side panel.
  • Reduction of the processor surface temperature by approx. -10 to 12°C.

Download Case Study