EDGE TO THE CLOUD, GREATER EFFICIENCY and LOWER COST OF OWNERSHIP
Maintaining high availability (uptime) at minimal operational costs remains a major challenge in today’s data centers and networks where a significant portion costs are dedicated to energy consumption for IT equipment and server cooling.
nVent SCHROFF offers a comprehensive range of standard and customized air, indirect and direct water cooling solutions. Our product range enables you to meet these challenges and protect your IT assets, whether for smaller decentralized edge computing, harsh environments, or large data center installations.
Direct Liquid Cooling / CDUs
Coolant Distribution Units and manifolds for high density, direct-to-chip liquid and hybrid cooling up to 100 kW per Rack
DIRECT-TO-CHIP LIQUID COOLING
- High density liquid cooling at processor level
- Rack-mount or row-based liquid-to-liquid Cooling Distribution Units
- Rack manifolds to manage liquid distribution between CDU and cold plate loops suitable for various server or rack environments
HYBRID HIGH DENSITY PRECISION COOLING
- Enable 100% utilization of rack and data center spaces at high densities
- Facilitate peak performance for processors
- Dependence on fans and expensive air handling systems is drastically reduced
- Reduce chilled water requirements and OPEX with warm water cooling
Rear Door Cooling
Rear door air-to-liquid heat exchanger for high performance computing, up to 55 kW/ rack
RACKCHILLER REAR DOOR
- Cools the warm exhaust air in the existing rack-mounted IT equipment through a large cooling coil surface before re-introducing to the room
- Completely passive or active with additional fan package
- Advanced control and sensor options (differential pressure, flow, temp.)
BENEFITS
- Passive solution: no noise, no power consumption, low maintenance
- Active solution: fans support the air flow and minimize pressure drop of the heat exchanger supporting heterogeneous rack-mount equipment
- Frame solution allows separation of coil and condensate management from the rack-mount equipment and rear space inside the cabinet is completely available for cabling and power distribution
- Available in 6 different standard dimensions
In-Row Cooling
In-row air-to-liquid heat exchangers with up to 75 kW per cooler
RACKCHILLER IN-ROW
- The entire cooling system is housed in a separate enclosure for easy integration into a row of contained server racks
- Fans move the warm exhaust air from the servers through an air-to-water heat exchanger, where it gets cooled before being provided into the cold aisle
BENEFITS
- The units can be scaled optimally to suit packaging density and redundancy can be implemented.
- Available in 2 different performance classes - Cooling performance of 55kW (300 mm) and 75kW (600 mm) in optimal operating conditions
- Built-in redundancy through EC fan technology
In-Rack Cooling
Racks with integrated air-to-liquid coolers for room-neutral operation, suitable for harsh environments / EMC shiedling and up to 25 kW per rack
RACKCHILLER IN-RACK
- The cooling unit is integrated into the rack, to the left or right of the 19” plane so the cabinet offers full RU (rack unit) mounting space
- The warm exhaust air from the servers flows through the air-to-water heat exchanger as the heat is transferred to the cooling medium, the cooled air is provided in front of the 19” plane
BENEFITS
- The rack-based cooling solution acts room-neutral and allows for setup of various rack configurations
- EMC-shielded, harsh environment as well as outdoor solutions available
- Reduced noise level