Testing wireless communication units

nVent SCHROFF Interscale chassis for single board computers allow flexibility in terms of dimensions, cutouts, mounting, and individual branding.

Technology:

Modular Interscale case platform for Small Form Factor boards and proprietary boards

Challenge:

For testing, today's low-cost Internet of Things devices a case needes to have a small footprint has to be cost-effective and provide flexible mounting options - from a free-standing case to a wall-mounted version, and also allow custom branding.

Solutions:

Use of Interscale case for single board solutions with integrated EMC shielding. With a modular platform, the case size is flexible, and the cutouts can be adapted for individual interfaces. Active cooling through three fans and perforations were added to prevent overheating. For specific customer branding requirements, the finish came with powder coating and silkscreen for detail prints.